SE95_7
?NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 2 September 2009
21 of 27
NXP Semiconductors
SE95
Ultra high accuracy digital temperature sensor and thermal watchdog
Fig 20. Package outline SOT505-1 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
L
H
E
L
p
w
y
v
c
e
D
(1)
E
(2)
Z
(1)
?/DIV>
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.70
0.35
6?/DIV>
0?/DIV>
0.1
0.1
0.1
0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1
99-04-09
03-02-18
w
M
b
p
D
Z
e
0.25
1
4
8
5
?/DIV>
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v
M
A
X
A
y
2.5
5 mm
0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
1.1
pin 1 index
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